Method of embedding semiconductor chip in support plate and...

Details Method of embedding semiconductor chip in support plate and... Method of embedding semiconductor chip in support plate and...

2006-10-31

2006-10-31

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S125000, C438S622000

Reexamination Certificate

active

07129117

ABSTRACT:
A method of embedding a semiconductor chip in a support plate and an embedded structure thereof are proposed. A first dielectric layer having a reinforced filling material is provided, and a semiconductor chip is mounted on the first dielectric layer. A support plate having an opening and a second dielectric layer having a reinforced filling material are provided. The first dielectric layer mounted with the semiconductor chip, the support plate, and the second dielectric layer are pressed together, such that the semiconductor chip is received in the opening of the support plate, and the dielectric layers fill in a gap between the semiconductor chip and the opening of the support plate. The reinforced filling material of the dielectric layers can maintain flatness and consistency of the semiconductor chip embedded in the support plate, and fine circuits can be fabricated on the support plate by build-up and electroplating processes.

REFERENCES:
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 6876554 (2005-04-01), Inagaki et al.
patent: 6964887 (2005-11-01), Akagawa
patent: 6991966 (2006-01-01), Tuominen

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