Method of eliminating uncontrolled voids in sheet adhesive...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step

Reexamination Certificate

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Details

C257S783000

Reexamination Certificate

active

06919230

ABSTRACT:
A preformed adhesive layer for joining components within integrated circuit packaging includes venting slots for controlling the size and location of voids within an assembled integrated circuit package. Air randomly entrapped between the surfaces of the adhesive layer and adjoining components during assembly will generally release into the venting slots during subsequent assembly and/or mounting steps performed at elevated temperatures, rather than creating internal pressures causing separation of package components or releasing into the encapsulant. Die delamination and encapsulant void problems occurring during reflow or other assembly and mounting processes as a result of entrapped air are avoided.

REFERENCES:
patent: 5391250 (1995-02-01), Cheney, II et al.
patent: 5528075 (1996-06-01), Burns
patent: 5889321 (1999-03-01), Culnane et al.
patent: 6051888 (2000-04-01), Dahl
patent: 6107678 (2000-08-01), Shigeta et al.
patent: 6407446 (2002-06-01), Kang et al.
patent: 403104263 (1991-05-01), None

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