Method of electroplating a copper or copper alloy interconnect

Details Method of electroplating a copper or copper alloy interconnect Method of electroplating a copper or copper alloy interconnect

1998-04-07

1999-10-19

Bell, Bruce F.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Forming nonelectrolytic coating before depositing...

205123, 205164, 438687, 438466, C23C 2802, C25D 502, C25D 556

Patent

active

059683333

ABSTRACT:
Copper or a copper alloy is electroplated to fill via/contact holes and/or trenches in a dielectric layer. A barrier layer is initially deposited on the dielectric layer lining the hole/trench. A thin conformal layer of copper or a copper alloy is sputter deposited on the barrier layer outside the hole/trench. Copper or a copper alloy is then electroplated on the conformal copper or copper alloy layer and filling the hole/trench. During electroplating, the barrier layer functions as a seed layer within the hole/trench while the sputter deposited conformal copper or copper alloy layer enhances the flow of electrons from the wafer edge inwardly to provide a favorable deposition rate.

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Hartsough et al., "High-Rate Sputtering of Enhanced Aluminum Mirrors", J. Vac. Sci. Technol., vol. 14, No. 1, pp. 123-126, no month available 1977.

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