Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-02-02
2010-02-09
Liu, Sue (Department: 1639)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S048000, C438S049000, C438S056000, C438S257000, C435S006120, C257S256000
Reexamination Certificate
active
07659149
ABSTRACT:
Provided is a method of sensing biomolecules using a bioFET, the method including: forming a layer including Au on a gate of the bioFET; forming a probe immobilized on a substrate separated from the gate by a predetermined distance, and a biomolecule having a thiol group (—SH) which is incompletely bonded to the probe; reacting the probe with a sample including a target molecule; and measuring a current flowing in a channel region between a source and a drain of the bioFET.
REFERENCES:
patent: 4238757 (1980-12-01), Schenck
patent: 4777019 (1988-10-01), Dandekar
patent: 5466348 (1995-11-01), Holm-Kennedy
patent: 5846708 (1998-12-01), Hollis et al.
patent: 6203981 (2001-03-01), Ackley et al.
patent: 6482639 (2002-11-01), Snow et al.
patent: 6815163 (2004-11-01), Breslauer et al.
patent: 2003/0027157 (2003-02-01), Fu et al.
Gilmour et al., Journal of Bacteriology, Dec. 2005, pp. 8196-8200.
Stephenson et al., Current Medicinal Chemistry, 2004, vol. 11, pp. 765-773.
Kim et al., Japanese Journal of Applied Physics. vol. 43(6B): 3855-3859; 2004.
Choi Soo-hyung
Jung Sung-ouk
Min Jun-hong
Namgoong Ji-na
Shim Jeo-young
Cantor & Colburn LLP
Liu Sue
Samsung Electronics Co,. Ltd.
LandOfFree
Method of electrically detecting biomolecule does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of electrically detecting biomolecule, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of electrically detecting biomolecule will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4229374