Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-06-27
2010-11-23
Nhu, David (Department: 2895)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S091000, C438S602000, C438S604000, C257SE21006, C257SE21051, C257SE21077, C257SE21085, C257SE21126, C257SE21127, C257SE21304, C257SE21328, C257SE21347
Reexamination Certificate
active
07838410
ABSTRACT:
A method of electrically connecting an element to wiring includes the steps of forming a conductive fixing member precursor layer at least on wiring provided on a base; and arranging an element having a connecting portion on the wiring such that the connecting portion contacts the conductive fixing member precursor layer, and then heating the conductive fixing member precursor layer to form a conductive fixing member latter, thereby fixing the connecting portion of the element to the wiring, with the conductive fixing member layer therebetween, wherein the conductive fixing member precursor layer is composed of a solution-tape conductive material.
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Hirao Naoki
Iwakoshi Yasunobu
Sam Huy
Tomoda Katsuhiro
K & L Gates LLP
Nhu David
Sony Corporation
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