Method of electrically connecting element to wiring, method...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S091000, C438S602000, C438S604000, C257SE21006, C257SE21051, C257SE21077, C257SE21085, C257SE21126, C257SE21127, C257SE21304, C257SE21328, C257SE21347

Reexamination Certificate

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07838410

ABSTRACT:
A method of electrically connecting an element to wiring includes the steps of forming a conductive fixing member precursor layer at least on wiring provided on a base; and arranging an element having a connecting portion on the wiring such that the connecting portion contacts the conductive fixing member precursor layer, and then heating the conductive fixing member precursor layer to form a conductive fixing member latter, thereby fixing the connecting portion of the element to the wiring, with the conductive fixing member layer therebetween, wherein the conductive fixing member precursor layer is composed of a solution-tape conductive material.

REFERENCES:
patent: 2004/0013249 (2004-07-01), Kim et al.
patent: 2007/0295973 (2007-12-01), Jinbo et al.
patent: 2008/0050851 (2008-02-01), Tanaka et al.
patent: 2008/0050895 (2008-02-01), Miyairi et al.
patent: 10-228249 (1998-08-01), None
patent: 11-117148 (1999-04-01), None
patent: 2000-315453 (2000-11-01), None
patent: 2004-215223 (2004-07-01), None
patent: 2005-317941 (2005-11-01), None
patent: 2006-135236 (2006-05-01), None
patent: 2006-147648 (2006-06-01), None
patent: 2006-165506 (2006-06-01), None
patent: 2008-135518 (2008-06-01), None
patent: 2008/078478 (2008-07-01), None

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