Method of drying a wafer

Details Method of drying a wafer Method of drying a wafer

1998-01-23

2000-01-11

Stinson, Frankie L.

Cleaning and liquid contact with solids

Processes

Work handled in bulk or groups

134147, 134153, 134902, 34314, 34317, B08B 302

Patent

active

060124709

ABSTRACT:
In a spin dryer for semiconductor wafers, the wafer is held beneath a platen with its active side (i.e., the side containing the components or circuitry) facing upward. One or more nozzles spray rinse water on the top surface of the wafer and the wafer is rotated to remove the excess rinse water, thereby drying the wafer. A splash guard adjacent the edge of the wafer insures that the excess rinse water thrown off by the spinning wafer is deflected downward where it cannot again come into contact with the active side of the wafer. The platen is rotated dry at the same time, with no rinse water being splashed back onto the active side of the wafer. The spin dryer also includes a separate section which cleans and dries the end-effector of the robot which inserts the wafer into the spin dryer while the wafer is being dried.

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