Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2002-09-30
2009-08-11
Vinh, Lan (Department: 1792)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S706000, C438S715000, C134S001100
Reexamination Certificate
active
07572736
ABSTRACT:
A system, method and product of dry-etching a semiconductor device are disclosed, the system having a material supply for forming a material layer on the semiconductor substrate, a pattern for disposing at least one photoresist pattern on the material layer, a dry-etching chamber for housing a dry-etching process of the material layer, a chiller for adjusting the temperature of the chamber, the semiconductor substrate, the material layer and/or the photoresist for the dry-etching process, a stage for loading the semiconductor substrate in the dry-etching chamber, and a dry-etchant supply for dry-etching the material layer while the integrity of the photoresist pattern is enhanced by the adjusted temperature.
REFERENCES:
patent: 5571366 (1996-11-01), Ishii et al.
patent: 5885902 (1999-03-01), Blasingame et al.
patent: 6100010 (2000-08-01), Ina
patent: 6107135 (2000-08-01), Kleinhenz et al.
patent: 6177341 (2001-01-01), Lai
patent: 6207583 (2001-03-01), Dunne et al.
patent: 6221772 (2001-04-01), Yang et al.
patent: 6221776 (2001-04-01), Smith
patent: 6367347 (2002-04-01), Blaschke et al.
patent: 6376347 (2002-04-01), Ohmura et al.
patent: 6649532 (2003-11-01), Chen et al.
patent: 2001/0008124 (2001-07-01), Jiwari et al.
patent: 2002/0072009 (2002-06-01), Kim et al.
patent: 2003/0068898 (2003-04-01), Lee et al.
patent: 2003/0159307 (2003-08-01), Sago et al.
patent: 06140187 (1994-05-01), None
Kurita et al., Plasma Treatment Device, May 20, 1994, English Abstract and Computer translation into English of JP 06140187 A, 6 pages.
Japanese Patent Publication No. Hei 10-199789 (Jul. 31, 1998). (English Abstract).
Chae Yun-Sook
Kang Chang-jin
Kim Ji-Soo
F. Chau & Associates LLC
Samsung Electronics Co,. Ltd.
Vinh Lan
LandOfFree
Method of dry-etching semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of dry-etching semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of dry-etching semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4074565