Method of dry copper etching and its implementation

Details Method of dry copper etching and its implementation Method of dry copper etching and its implementation

1984-08-01

1985-12-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156656, 1566591, 156666, 204192E, 252 791, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

045577960

ABSTRACT:
According to this method, copper is dry etched in a glow discharge containing compounds with at least one methyl or methylene group, particularly at temperatures close to room temperature.
The method is applied in particular for making conductors on or in module substrates or circuit cards, solder spots, and the wiring of magnetic thin films.

REFERENCES:
patent: 4416725 (1983-11-01), Cuomo et al.
patent: 4468284 (1984-08-01), Nelson

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