Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2007-01-23
2007-01-23
Norton, Nadine G. (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S706000, C438S710000, C438S712000, C438S723000, C438S724000, C438S725000, C438S730000, C252S079100, C216S016000, C134S001100
Reexamination Certificate
active
10253384
ABSTRACT:
Semiconductor manufacturing processes that reduce production costs as well as increase throughput by substituting the PR strip and ACT wet cleaning procedure after the via contact etching of a semiconductor with dry cleaning to be performed while removing a photoresist in a conventional PR strip apparatus. In addition, the methods can shorten waiting time and maintain consistency in the process by performing the PR strip and cleaning at the same time in the same chamber. The resultant devices have lower via contact resistance and its deviation, as compared to the conventional PR strip and ACT wet cleaning.
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Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
Norton Nadine G.
Umez-Eronini Lynette T.
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