Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-03-25
1987-05-05
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 156643, B44C 122, C03C 2506, C03C 1500, H01L 21306
Patent
active
046629874
DESCRIPTION:
BRIEF SUMMARY
In the Dutch Patent Application Nos. 8 103 979, 8 22 753 and 8 203 318 of applicant installations with double-floating transport and processing of substrates and tape are described.
Thereby in a narrow tunnel passage the wafer transport and processing takes place under double-floating condition by means of a fluid medium, with the changing thereof into a gaseous medium and oppositely.
To remove such fluid medium from the wafer by means of gaseous medium it is required, that the width of the gap in between the wafer and the lower block and respectively upper block be relatively large, f.i. 0,5-1.5 mm, to prevent such a sticking of the wafer against such block, such that the gaseous medium is not able to remove this fluid medium effectively.
As a result, the consumption of medium and in particular of gaseous medium for such wafer transport and processing has to be considerable.
In addition, provisions, such as flow restrictors, have to be located in the medium supply channels as a need to prevent a moving of the wafer from the vertical centre of the tunnel passage towards the upper- or lower block, because in that case the balance in forces of both sides of the tunnel passage, acting on the wafer, can easily be disturbed.
With the installation according to the present invention these objections are removed, whereby it is mainly characterized by having recesses in the main portion of the block sections aside the supply channels for the medium, said recessed areas providing an increased height of the tunnel passage.
Another very positive feature is, that an elevated wall aside such recess is located in between that recess and the medium discharge channel.
Thereby a difference in height between the top of such sidewall and the recessed portion of 1 mm with a minimum size of such tops which is essential for some processings.
Furthermore, a combination of supply and discharge channels is possible, wherein in the direction of wafer movement in succession two supply channels are arranged with in between a separation wall and whereby the medium flows towards discharge channels, positioned on each side of such a combination of supply channels.
Thereby flows of medium, moving in opposite directions, are accomplished to enable an optimal control of the wafer transport and processing.
Another positive feature is, that such elevated walls in between both supply channels also have a height, that at least is almost the same as that of the separation wall in between such recess and the discharge channel.
In the upper and lower block the mouthes of a plurality of medium supply channels are arranged aside each other in a lateral direction over almost the entire passage width, whereas in each such block the groups of discharge channels also are arranged in a lateral direction.
A following very positive feature of the installation is that the separation wall in between such groups of supply and discharge channels extends in a lateral direction over at least almost the entire tunnel width.
A following positive feature is, that the sidewall in between the small top and the lower base is inclined.
During the moving of the medium in the passage cap aside the wafer, this medium is urged to move along the top of such side wall towards the discharge channel, with an increased pressure in the recesses.
As a result, an increased thrust of the medium on the wafer is accomplished and such thrust is in a direction, desired and under an ideal double-floating condition for such wafer.
Another positive feature is, that such elevated separation walls in between the supply and discharge channels are recessed to enable increased flows of medium in the direction, desired.
The separation walls, extending in a lateral direction, can be connected with each other by means of walls, having approximately the same height and extending in a longitudinal direction with respect to the tunnel passageway.
These walls minimize the escape of medium from the recesses in a lateral direction.
Furthermore, the two groups of supply channels aside the lateral centre
REFERENCES:
patent: 4495024 (1985-01-01), Bok
patent: 4521268 (1985-06-01), Bok
patent: 4544446 (1985-10-01), Cady
patent: 4560590 (1985-12-01), Bok
Integrated Automation Limited
Olsen Warren E.
Powell William A.
Semmes David H.
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