Method of doping gan layers p-type for device fabrication

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from gaseous state combined with preceding...

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438503, 117952, H01L 2120

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active

058888861

ABSTRACT:
High p-type impurity concentration levels are achieved in Group III nitride semiconductor layers by depositing a nitrogen-rich surface onto a supporting layer while impeding the flow of Group III element reactant. Thereafter, the Group III element source is introduced into the reactor to generate a p-type region having a high impurity concentration. The flow of the reactant from the active nitrogen source is kept below about 300 sccm and the temperature of the reactor is reduced below 1075.degree. C. in order to provide improved surface characteristics.

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