Method of dividing circuit pattern, method of manufacturing...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S030000

Reexamination Certificate

active

10948154

ABSTRACT:
A method of dividing a circuit pattern for creating complementary stencil masks corresponding to complementary patterns, the method comprising a step of dividing a circuit pattern into a plurality of complementary patterns including a first complementary pattern comprising a pattern of a cantilevered beam member having a support portion width W1and a length L1, and a second complementary pattern comprising a pattern of a both end-supported beam member having a support portion width W2and a length L2. The dividing of the circuit pattern is performed in a manner that a aspect ratio A1(L1/W1) of the pattern of the cantilevered beam member is confined to not more than 100, and that a aspect ratio A2(L2/W2) of the pattern of the both end-supported beam member is confined to not more than 150.

REFERENCES:
patent: 5347592 (1994-09-01), Yasuda et al.
patent: 5874198 (1999-02-01), Okino
patent: 6647543 (2003-11-01), Yamada et al.
patent: 6741733 (2004-05-01), Kobinata
patent: 6855467 (2005-02-01), Amemiya
patent: 2001/0028984 (2001-10-01), Yamashita et al.
patent: 2002/0124235 (2002-09-01), Yamashita
patent: 2003/0017401 (2003-01-01), Kawata et al.
patent: 2003/0027058 (2003-02-01), Kato
patent: 2003/0054580 (2003-03-01), Yamamoto et al.
patent: 2003/0093767 (2003-05-01), Murai et al.
patent: 7-29793 (1995-01-01), None
patent: 7-271012 (1995-10-01), None
patent: 2001-244192 (2001-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of dividing circuit pattern, method of manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of dividing circuit pattern, method of manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of dividing circuit pattern, method of manufacturing... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3882524

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.