Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2005-12-27
2010-06-22
Chiang, Jack (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
Reexamination Certificate
active
07743356
ABSTRACT:
A method of disposing a dummy pattern includes the steps of obtaining an inter-wiring parasitic capacity and a wiring total parasitic capacity for each wiring using wiring layout data and initial dummy pattern layout data; creating a first data base based on the inter-wiring parasitic capacity; creating a second data base based on the wiring total parasitic capacity; performing dynamic and static simulations for creating a third data base storing the results of the dynamic and static simulations, the result of the dynamic simulation being information about the first wiring, and the result of the static simulation being information about the second wiring; and performing an additional insertion of dummy pattern near a third wiring, the third wiring being determined to be a wiring which is capable of be affected by voltage noise based on the data in the third data base.
REFERENCES:
patent: 2002/0116696 (2002-08-01), Suaya et al.
patent: 2003/0145296 (2003-07-01), Chandra et al.
patent: 2003/0229875 (2003-12-01), Smith et al.
patent: 2004/0034838 (2004-02-01), Liau
patent: 10/178013 (1998-06-01), None
patent: 10/335326 (1998-12-01), None
patent: 2000/277615 (2000-10-01), None
patent: 2001/203272 (2001-07-01), None
Sylvester et al., “Investigation of Interconnect Capacitance Characterization Using Charge-Based Capacitance Measurement (CBCM) Technique and Three-Dimensional Simulation”, IEEE Journal of Solid-State Circuits, vol. 33, No. 3, 1998, pp. 449-453.
Elgamel et al., “Interconnect Noise Analysis and Optimization in Deep Submicron Technology”, IEEE Circuits and Systems Magazine, vol. 3, No. 4, 2003, pp. 6-17.
Chiang Jack
Lin Aric
Oki Semiconductor Co., Ltd.
Rabin & Berdo P.C.
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