Method of dicing a semiconductor substrate into a plurality...

Details Method of dicing a semiconductor substrate into a plurality... Method of dicing a semiconductor substrate into a plurality...

2008-07-29

2008-07-29

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S464000, C257SE21602

Reexamination Certificate

active

07405137

ABSTRACT:
In a manufacturing method of a semiconductor device, a semiconductor substrate having a plurality of semiconductor chips formed on one of principal surfaces of the substrate is cut into the plurality of semiconductor chips through dicing. A first cutting process is formed on one of the principal surfaces of the substrate to produce two cutting grooves between two neighboring ones of the plurality of semiconductor chips, each cutting groove being adjacent to one of the neighboring ones of the plurality of semiconductor chips. A second cutting process is performed on the other of the principal surfaces of the substrate to produce a cutting groove overlapping the two cutting grooves produced by the first cutting process.

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Chinese Office Action dated Aug. 3, 2007 issued in corresonding Chinese Application No. 200510083385.3.

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