Method of deposition

Details Method of deposition Method of deposition

1998-10-13

2000-06-06

Rosasco, S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

G03C 500

Patent

active

060716762

ABSTRACT:
There is described a method of chemically depositing a substance. The method is of utility in the direct manufacture of integrated circuits and in the manufacture of a photomask for use in production of integrated circuits. The method involves the use of a compound which degrades into a deposit and a residue when a radiant beam (e.g. a laser beam) or a particle beam (e.g. an electron beam) is applied. The residue and any unreacted compound may be washed off the substrate to which it has been applied. Nanoscale dimensions of the deposit can be achieved. A particularly suitable organometallic compound is tetra-sec butyl diaurum difluoride.

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Research Disclosure, Mar. 10, 1992, Havant, UK, p. 211 XP000301117, Anonymous, "Pin Repair of MLC Substrate I/O Pads by Focused Ion Beam Techniques".
T. Mole, E.A. Jeffery, "Organoaluminium Compounds", 1972, Elsevier Publishing Company, Amsterdam, The Netherlands.

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