Method of depositing silicon thin film and silicon thin film...

Details Method of depositing silicon thin film and silicon thin film... Method of depositing silicon thin film and silicon thin film...

2005-02-01

2005-02-01

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Reexamination Certificate

active

06849560

ABSTRACT:
In a method of depositing a silicon thin film by using a vertical plasma CVD apparatus having steps of holding a substrate having an area not smaller than 1,200 cm2and having a conductive film formed thereon with a substrate holder, disposing the substrate to face an electrode, and depositing a silicon thin film under a power density of 100 mW/cm2or more, the substrate holder is electrically insulated from the conductive film formed on the surface of the substrate by forming a separation groove in the conductive film.

REFERENCES:
patent: 5364481 (1994-11-01), Sasaki et al.
patent: 6250822 (2001-06-01), Wakamiya et al.
patent: 454100 (1991-10-01), None
patent: 994515 (2000-04-01), None
patent: 1 089 346 (2001-04-01), None
patent: 56-40282 (1981-04-01), None
patent: 56-040282 (1981-04-01), None
patent: 56040282 (1981-04-01), None
patent: 05-166733 (1993-07-01), None
patent: 05-265033 (1993-10-01), None
patent: 7-7840 (1995-01-01), None
patent: 2635950 (1997-04-01), None
patent: 10-120491 (1998-05-01), None
patent: 11-186573 (1999-07-01), None
patent: 200-150944 (2000-05-01), None
patent: 2000-225547 (2000-08-01), None
patent: 02064854 (2002-08-01), None

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