Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Diffusing a dopant
Reexamination Certificate
2007-02-13
2007-02-13
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Diffusing a dopant
C257SE21023, C433S149000
Reexamination Certificate
active
10630301
ABSTRACT:
The invention generally encompasses a method for forming a pattern on a substrate. The method comprises applying a precursor comprising at least one metal to a substrate to form a precursor layer, exposing a predetermined portion of the precursor layer and developing the predetermined portion of the precursor layer. The developing step removes, or at least substantially removes, the predetermined portion from the substrate, thereby forming a pattern on the substrate that comprises a remaining portion of the precursor. In one embodiment, the precursor layer comprises Ti(PriO)2(EAA)2.
REFERENCES:
patent: 4770590 (1988-09-01), Hughes et al.
patent: 5140366 (1992-08-01), Shiozawa et al.
patent: 5178989 (1993-01-01), Heller et al.
patent: 5272099 (1993-12-01), Chou et al.
patent: 5292558 (1994-03-01), Heller et al.
patent: 5436176 (1995-07-01), Shimizu et al.
patent: 5470693 (1995-11-01), Sachdev et al.
patent: 5534312 (1996-07-01), Hill et al.
patent: 5627087 (1997-05-01), Hsu et al.
patent: 5652166 (1997-07-01), Sun et al.
patent: 5716758 (1998-02-01), Bae et al.
patent: 5849465 (1998-12-01), Uchida et al.
patent: 5935762 (1999-08-01), Dai et al.
patent: 5989759 (1999-11-01), Ando et al.
patent: 6072207 (2000-06-01), Yoshimori et al.
patent: 6307087 (2001-10-01), Buchwald et al.
patent: 6348239 (2002-02-01), Hill et al.
patent: 6387012 (2002-05-01), Mitamura
patent: 6458431 (2002-10-01), Hill et al.
patent: 6723388 (2004-04-01), Svendsen et al.
patent: 6723486 (2004-04-01), Wallow et al.
patent: 6787198 (2004-09-01), Mukherjee et al.
patent: 6790579 (2004-09-01), Goodall et al.
patent: 2002/0076495 (2002-06-01), Maloney et al.
patent: 2003/0073042 (2003-04-01), Cernigliaro et al.
patent: 2004/0087690 (2004-05-01), Lamanna et al.
patent: 2005/0285312 (2005-12-01), Fury et al.
Blair Sharon Louise
Hill Ross H.
Li Grace
Ruan Haixiong
Zhang Xin
Coleman W. David
Simon Fraser University
LandOfFree
Method of depositing patterned films of materials using a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of depositing patterned films of materials using a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of depositing patterned films of materials using a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3894159