Method of depositing dielectric films

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C427S577000, C427S249150, C427S255290, C438S784000

Reexamination Certificate

active

07117064

ABSTRACT:
A method of forming a silicon carbide layer for use in integrated circuit fabrication processes is provided. The silicon carbide layer is formed by reacting a gas mixture comprising a silicon source, a carbon source, and a dopant in the presence of an electric field. The as-deposited silicon carbide layer has a compressibility that varies as a function of the amount of dopant present in the gas mixture during later formation.

REFERENCES:
patent: 3960619 (1976-06-01), Seiter
patent: 4262631 (1981-04-01), Kubacki
patent: 4532150 (1985-07-01), Endo et al.
patent: 4634601 (1987-01-01), Hamakawa et al.
patent: 4759947 (1988-07-01), Ishihara et al.
patent: 4822697 (1989-04-01), Haluska et al.
patent: 4885220 (1989-12-01), Kuhman et al.
patent: 4894352 (1990-01-01), Lane et al.
patent: 5082695 (1992-01-01), Yamada et al.
patent: 5103285 (1992-04-01), Furumura et al.
patent: 5238866 (1993-08-01), Bolz et al.
patent: 5300951 (1994-04-01), Yamazaki
patent: 5465680 (1995-11-01), Loboda
patent: 5508067 (1996-04-01), Sato et al.
patent: 5591494 (1997-01-01), Sato et al.
patent: 5591566 (1997-01-01), Ogawa
patent: 5597566 (1997-01-01), Huls
patent: 5711987 (1998-01-01), Bearinger et al.
patent: 5818071 (1998-10-01), Loboda et al.
patent: 5926740 (1999-07-01), Forbes et al.
patent: 5953627 (1999-09-01), Carter et al.
patent: 5989998 (1999-11-01), Sugahara et al.
patent: 5998100 (1999-12-01), Azuma et al.
patent: 6041734 (2000-03-01), Raoux et al.
patent: 6046758 (2000-04-01), Brown et al.
patent: 6051321 (2000-04-01), Lee et al.
patent: 6054379 (2000-04-01), Yau et al.
patent: 6060132 (2000-05-01), Lee
patent: 6068884 (2000-05-01), Rose et al.
patent: 6140226 (2000-10-01), Grill et al.
patent: 6147009 (2000-11-01), Grill et al.
patent: 6159871 (2000-12-01), Loboda et al.
patent: 6287990 (2001-09-01), Cheung et al.
patent: 6312793 (2001-11-01), Grill et al.
patent: 6316167 (2001-11-01), Angelopoulos et al.
patent: 6340628 (2002-01-01), Van Cleemput et al.
patent: 6364954 (2002-04-01), Umotoy et al.
patent: 6410437 (2002-06-01), Flanner et al.
patent: 6417092 (2002-07-01), Jain
patent: 6436824 (2002-08-01), Chooi et al.
patent: 6444568 (2002-09-01), Sundararajan et al.
patent: 6462371 (2002-10-01), Weimer et al.
patent: 6465366 (2002-10-01), Nemani et al.
patent: 6528423 (2003-03-01), Catabay et al.
patent: 6534397 (2003-03-01), Okada et al.
patent: 6537733 (2003-03-01), Campana et al.
patent: 6555476 (2003-04-01), Olsen et al.
patent: 6593653 (2003-07-01), Sundararajan et al.
patent: 6627532 (2003-09-01), Gaillard et al.
patent: 6630412 (2003-10-01), Shioya et al.
patent: 6645883 (2003-11-01), Yamamoto et al.
patent: 6764958 (2004-07-01), Nemani et al.
patent: 6794311 (2004-09-01), Huang et al.
patent: 6849562 (2005-02-01), Lang et al.
patent: 2002/0164872 (2002-11-01), Han et al.
patent: 2002/0182894 (2002-12-01), Andideh
patent: 2003/0020108 (2003-01-01), Weimer et al.
patent: 2003/0045125 (2003-03-01), Bao et al.
patent: 0 771 886 (1997-06-01), None
patent: 0 926 715 (1999-06-01), None
patent: 0 926 724 (1999-06-01), None
patent: 61257475 (1986-11-01), None
patent: 10223758 (1998-08-01), None
patent: WO 00/19498 (2000-04-01), None
patent: WO 00/19508 (2000-04-01), None
European Search Report from EP 01 11 6054. Dated Oct. 30, 2001.

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