Method of delineating a desired integrated circuit pattern upon

Details Method of delineating a desired integrated circuit pattern upon Method of delineating a desired integrated circuit pattern upon

1980-05-22

1981-12-08

Brown, J. Travis

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430272, 430281, 430296, 430942, 430967, G03C 500

Patent

active

043048404

ABSTRACT:
A method is disclosed of delineating a desired integrated circuit pattern upon a circuit substrate. According to the method, the copolymer poly(methyl alpha-chloroacrylate-co-methacrylonitrile) is formed by emulsion polymerization techniques. The copolymer is then dissolved in a spinning solvent that will dissolve the copolymer and form a viscous solution. The solution is applied to the surface of the substrate and the substrate spinned to form a smooth, uniform resist film of about 0.3 to 1.0 micron in thickness. The resist film is heated and the region of the resist film to be patterned then exposed to ionizing radiation until exposures greater than 1.5.times.10.sup.-5 C/cm.sup.2 are obtained. The exposed regions of the resist are then developed to the substrate.

REFERENCES:
Lai et al., Journal of Vacuum Sci. Technology, Nov./Dec. 1979, pp. 1992-1. 5

Affiliated with

Also associated with

Rating

Method of delineating a desired integrated circuit pattern upon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of delineating a desired integrated circuit pattern upon , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of delineating a desired integrated circuit pattern upon will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-568243