Method of decreasing resistivity in an electrically conductive l

Details Method of decreasing resistivity in an electrically conductive l Method of decreasing resistivity in an electrically conductive l

1996-09-03

1998-09-01

Everhart, Caridad

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438660, 438685, 438688, H01L 21441

Patent

active

058010980

ABSTRACT:
A method of decreasing resistivity in an electrically conductive layer (23) includes providing a substrate (14), using a high density plasma sputtering technique to deposit the electrically conductive layer (23) over the substrate (14), and exposing the electrically conductive layer (23) to an anneal in an ambient comprised of a plasma (21).

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Rossnagel; "Directional Sputter Deposition for Semiconductor Applications"; Mat. Res. Soc. Symp. Proc., vol. 354; pp. 503-510 (1996).
Rossnagel, et al.; "Magnetron sputter deposition with high levels of metal ionization", Appl. Phys. Lett. 63 (24); pp. 3285-3287 (1993).

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