Method of customizing integrated circuits by depositing two resi

Details Method of customizing integrated circuits by depositing two resi Method of customizing integrated circuits by depositing two resi

1998-03-12

1999-11-23

McPherson, John A.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430317, 430314, G03F 700

Patent

active

059897830

ABSTRACT:
A method for fabricating custom integrated circuits includes the steps of 1) patterning a photoresist layer on an insulative layer with a standard via precision mask to define all possible vias, and 2) using a targeting energy beam to select the desired via locations on a second photoresist layer, which are then etched and interconnections made, for customization or repair of the integrated circuit. Consequently, the present invention requires no custom mask so that application specific integrated circuits (ASICs) can be produced with lower lead-time and costs when compared to prior methods.

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