Method of cross-mapping integrated circuit design formats

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000, C702S094000, C702S095000

Reexamination Certificate

active

06941530

ABSTRACT:
A method of cross-mapping integrated circuit (“IC”) elements nets in a IC and/or directing a probe to points on an IC to achieve minimal interference from adjacent structures is disclosed. The method of provides a more streamlined approach than referencing points from a physical layout representation of the IC to the actual IC being tested. The improved correlation between the actual packaged IC and the layout of the IC is accomplished using artificial locator cells. Preferably, the artificial locator cells are generated from mathematical operations of the extracted version of the layout, and they further provide coordinate information for where minimal interference from adjacent structures may be accomplished. Artificial locator cells may be generated from a layout representing a hierarchical representation or alternately each element that is instantiated from a reference library may already have artificial locator cells included.

REFERENCES:
patent: 5530372 (1996-06-01), Lee et al.
patent: 5675499 (1997-10-01), Lee et al.
patent: 5831735 (1998-11-01), Corby, Jr.
patent: 6629065 (2003-09-01), Gadh et al.
R. Scharf et al., “DRC-Based Selection of Optimal Probing Points for Chip-Internal Measurements,” IEEE, 1992, pp. 840-847.
R. Scharf et al., “Layout Analysis and Automatic Test Point Selection for Fast Prototype Debug Using E-Beam or Laser-Beam Testsystems,” IEEE, 1992, pp. 17.3.1-17.3.4.
H.P. Ho, “Application of Dual Probe Direct Interference to Multilayered High Density Optical Storage: A Proposal,” IEEE, Mar. 1997, pp. 621-622.
Quintard et al., “Temperature Measurement of Metal Lines Under Current Stress by High-Resolution Laser Probing,” IEEE, Feb. 1999, pp. 69-74.
Chiu-sing et al., “Test Generation with Dynamic Probe Points in High Observability Testing Environment,” IEEE, 1996, pp. 88-96.
Lin et al., “A New Algorithm for CAD-Directed CMM Dimensional Inspection,” IEEE, May 1998, pp. 893-898.
Neil H.E. Weste and Kamran Eshraghian;Principles of CMOS VLSI Design, A Systems Perspective Second Edition; (85 p.); 1993. Only p. 381-461.
Edward I. Cole, Jr., Jerry M. Soden, James L. Rife, Daniel L. Barton and Christopher L. Henderson;Novel Failure Analysis Techniques Using Photon Probing With A Scanning Optical Microscope; IRPS, (11 p.); 1994.

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