Method of creating a solderable metal layer on glass or ceramic

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430313, 134 2, 216 41, 216103, 427 96, G03F 700

Patent

active

061596639

ABSTRACT:
A method for creating a solderable metal layer on a ceramic, glass, or glass ceramic member is described. The described method deposits an aluminum containing mixture on the member by ion vapor deposition creating a metalized ceramic member. A photoresist is applied to the metalized ceramic member. A photomask is applied to the photoresist and the photoresist is exposed to light. After the photomask and exposed photoresist are stripped off, the underlying aluminum containing mixture is removed with an etchant. The remaining photoresist is removed and a metal corrosion inhibiting layer is deposited on the remaining aluminum containing mixture. A solderable layer is then deposited on the metal corrosion inhibiting layer.

REFERENCES:
patent: 3767398 (1973-10-01), Morgan
patent: 4122215 (1978-10-01), Vratny
patent: 4423137 (1983-12-01), Rester
patent: 5141829 (1992-08-01), Dumas et al.
patent: 5169680 (1992-12-01), Ting et al.
patent: 5308745 (1994-05-01), Schwartzkopf
patent: 5358826 (1994-10-01), Steitz et al.

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