Method of copper/copper surface bonding using a conducting...

Details Method of copper/copper surface bonding using a conducting... Method of copper/copper surface bonding using a conducting...

2004-11-15

2008-11-18

Monbleau, Davienne (Department: 2893)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

07452808

ABSTRACT:
A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

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The Merck Index, ninth edition, Merck and Co., Inc., Rahway, NJ, USA, 1976, p. 844, 6318 Nickel Carbonyl.

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