Method of cooling wafers

Details Method of cooling wafers Method of cooling wafers

1998-09-10

2000-08-29

Ferensic, Denise L.

Drying and gas or vapor contact with solids

Process

Cooling by gas or vapor contact

34448, 34508, F26B 700

Patent

active

061089370

ABSTRACT:
Methods and apparatuses are provided for cooling semiconductor substrates prior to handling. In one embodiment, a substrate and support structure combination is lifted after high temperature processing to a cold wall of a thermal processing chamber, which acts as a heat sink. Conductive heat transfer across a small gap from the substrate to the heat sink speeds wafer cooling prior to handling the wafer (e.g., with a robot). In another embodiment, a separate plate is kept cool within a pocket during processing, and is moved close to the substrate and support after processing. In yet another embodiment, a cooling station between a processing chamber and a storage cassette includes two movable cold plates, which are movable to positions closely spaced on either side of the wafer.

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