Method of controlling stepper process parameters based upon...

Details Method of controlling stepper process parameters based upon... Method of controlling stepper process parameters based upon...

2005-11-22

2005-11-22

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

C430S311000

Reexamination Certificate

active

06967068

ABSTRACT:
A method comprised of forming a process layer above a wafer, forming an ARC layer above the process layer, determining at least one optical characteristic of the ARC layer, and determining, based upon the determined optical characteristic of the ARC layer, at least one parameter of a stepper exposure process. The present invention is also directed to a system that may be used to perform the methods described herein. In one embodiment, the system is comprised of an optical metrology tool for measuring at least one optical characteristic of an ARC layer formed above a process layer, a controller for determining, based upon data obtained from the optical metrology tool, at least one parameter of a stepper exposure process, and a stepper tool for performing the exposure process comprised of the determined at least one parameter.

REFERENCES:
patent: 6368762 (2002-04-01), Ling
patent: 6479200 (2002-11-01), Stirton
patent: 6482573 (2002-11-01), Bhakta et al.
patent: 6689519 (2004-02-01), Brown et al.
patent: 2002/0076843 (2002-06-01), Ruelke et al.

Affiliated with

Also associated with

Rating

Method of controlling stepper process parameters based upon... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of controlling stepper process parameters based upon..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of controlling stepper process parameters based upon... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3499899