Method of controlling probe tip sanding in semiconductor...

Details Method of controlling probe tip sanding in semiconductor... Method of controlling probe tip sanding in semiconductor...

2006-08-22

2006-08-22

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

C257SE21521, C257SE21529

Reexamination Certificate

active

07094615

ABSTRACT:
In a method of and apparatus for controlling probe tip sanding in semiconductor device testing equipment, resistance values of pads of a probed chip are measured and stored. If a maximum resistance value among the stored resistance values is greater than a contact resistance reference value, a consecutive fail counting value and an accumulated fail counting value are increased. An automatic sanding command is generated to activate automatic sanding of a probe tip, when at least one of the consecutive fail counting value and the accumulated fail counting value is greater than a respective counting reference value. In this manner, false negative readings in the testing of semiconductor devices as the result of increased contact resistance between a probe tip and a pad in an EDS test are reduced and therefore device yield is improved.

REFERENCES:
patent: 6265232 (2001-07-01), Simmons
patent: 6366100 (2002-04-01), Ito et al.

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