Method of controlling grain size in a polysilicon layer and...

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure

Reexamination Certificate

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C257SE29303, C257S914000, C438S309000, C438S488000

Reexamination Certificate

active

10695336

ABSTRACT:
A method of modulating grain size in a polysilicon layer and devices fabricated with the method. The method comprises forming the layer of polysilicon on a substrate; and performing an ion implantation of a polysilicon grain size modulating species into the polysilicon layer such that an average resultant grain size of the implanted polysilicon layer after performing a pre-determined anneal is higher or lower than an average resultant grain size than would be obtained after performing the same pre-determined anneal on the polysilicon layer without a polysilicon grain size modulating species ion implant.

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Carbone et al., “Correlation of Ellipsometric Vol. Fraction to Polysilicon Grain Size from Transmission Electron Microscopy”, Sep. 1999, IEEE/SEMI Adv. Semiconductor Mfg. Conf. and Workshop, pp. 359-367.

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