Drying and gas or vapor contact with solids – Process – Gas or vapor pressure varies during treatment
Reexamination Certificate
1999-09-07
2001-09-11
Wilson, Pamela A. (Department: 3749)
Drying and gas or vapor contact with solids
Process
Gas or vapor pressure varies during treatment
C034S410000, C034S412000, C414S217000, C414S220000, C414S939000
Reexamination Certificate
active
06286230
ABSTRACT:
The foregoing patent applications, which are assigned to the assignee of the present application, are incorporated herein by reference in their entirety.
BACKGROUND
The present invention relates generally to substrate processing systems, and, in particular, to gas flow control in a substrate processing system.
Glass substrates containing as many as one million thin film transistors are being used for applications such as active matrix television and computer displays, among others.
The processing of large glass substrates often involves the performance of multiple sequential steps, including, for example, the performance of chemical vapor deposition (CVD) processes, physical vapor deposition (PVD) processes, or etch processes. Systems for processing glass substrates can include one or more process chambers for performing those processes.
The glass substrates can have dimensions, for example, of 550 mm by 650 mm. The trend is toward even larger substrate sizes, such as 650 mm by 830 mm and larger, to allow more displays to be formed on the substrate or to allow larger displays to be produced. The larger sizes place even greater demands on the capabilities of the processing systems.
Some of the basic processing techniques for depositing thin films on the large glass substrates are generally similar to those used, for example, in the processing of semiconductor wafers. Despite some of the similarities, however, a number of difficulties have been encountered in the processing of large glass substrates that cannot be overcome in a practical way and cost effectively by using techniques currently employed for semiconductor wafers and smaller glass substrates.
For example, efficient production line processing requires rapid movement of the glass substrates from one work station to another, and between vacuum environments and atmospheric environments. The large size and shape of the glass substrates makes it difficult to transfer them from one position in the processing system to another. As a result, cluster tools suitable for vacuum processing of semiconductor wafers and smaller glass substrates, such as substrates up to 550 mm by 650 mm, are not well suited for the similar processing of larger glass substrates, such as 650 mm by 830 mm and above. Moreover, cluster tools require a relatively large floor space.
Similarly, chamber configurations designed for the processing of relatively small semiconductor wafers are not particularly suited for the processing of these larger glass substrates. The chambers must include apertures of sufficient size to permit the large substrates to enter or exit the chamber. Moreover, processing substrates in the process chambers typically must be performed in a vacuum or under low pressure. Movement of glass substrates between processing chambers, thus, requires the use of valve mechanisms which are capable of closing the especially wide apertures to provide vacuum-tight seals and which also must minimize contamination.
Furthermore, when a large glass substrate is intended for subsequent use as a single item, such as a flat panel display, relatively few defects in the substrate can cause the entire unit to be rejected. Therefore, reducing the occurrence of defects in the glass substrate when it is transferred from one position to another is critical. Similarly, misalignment of the substrate as it is transferred and positioned within the processing system can cause the process uniformity to be compromised to the extent that one edge of the glass substrate is electrically non-functional once the glass has been formed into a display. If the misalignment is severe enough, it even may cause the substrate to strike structures and break inside the vacuum chamber.
Other problems associated with the processing of large glass substrates arise due to their unique thermal properties. For example, the relatively low thermal conductivity of glass makes it more difficult to heat or cool the substrate uniformly. In particular, thermal losses near the edges of any large-area, thin substrate tend to be greater than near the center of the substrate, resulting in a non-uniform temperature gradient across the substrate. The thermal properties of the glass substrate combined with its size, therefore, makes it more difficult to obtain uniform characteristics for the electronic components formed on different portions of the surface of a processed substrate. Moreover, heating or cooling the substrates quickly and uniformly is more difficult as a consequence of its poor thermal conductivity, thereby reducing the ability of the system to achieve a high throughput.
One recently proposed system for processing large glass substrates is a modular in-line processing system, such as the system described in the previously mentioned U.S. patent application Ser. No. 08/946,922. Such a system can include multiple back-to-back input, output and processing chambers. The venting and purging of the various chambers should be coordinated to maximize throughput, increase efficiency, the reduce the likelihood of cross-contamination between chambers.
SUMMARY
In general, a substrate processing system can include, for example, an evacuable chamber adjacent a process chamber, back-to-back process chambers, or other combinations of evacuable chambers and process chambers. The processing system includes various isolation valves disposed between adjacent chambers, as well as gas flow valves and vacuum valves. A controller controls the respective positions of the various gas flow valves and vacuum valves depending, in part, on whether the various isolation valves are in their open or sealed positions. By controlling the positions of the valves, the flow of gas to and from the different chambers can be controlled, for example, to help maximize throughput, increase efficiency, and reduce the likelihood of cross-contamination between chambers.
Various features present in some implementations are described in greater detail in the detailed description below and in the accompanying drawings.
In general, some of the implementations include one or more of the following advantages. An outward gas flow can be provided through the input chamber door, for example, during substrate loading to help reduce water condensation within the input chamber. Such internal water condensation can react with residual corrosive gases that may flow into the input chamber from the process chambers. Thus, reducing the internal water condensation can help prevent corrosive reactions within the input chamber. Similarly, an outward gas flow can be provided through the output chamber door during substrate unloading to help reduce internal water condensation within the output chamber. The outward gas flows also can decrease the time required for transitions from vacuum or other low pressure to atmospheric pressure, thereby permitting an increase in the system throughput. A restricted flow of pre-heated gas can be provided to the input chamber, for example, during initial stages of a transition to vacuum to facilitate heating the substrate by convective processes. The convective heating can speed up the heating process performed prior to transferring the substrate to a process chamber. Similarly, a restricted flow of pre-cooled gas can be provided to the output chamber, for example, during initial stages of a transition to atmospheric pressure can facilitate cooling the substrate by convective processes. The convective cooling can speed up the cooling process performed prior to unloading the substrate from the output chamber. Such heating and cooling of the respective input and output chambers can increase the throughput of the system further. The flow of gas in the input and output chambers, respectively, during the pre-heating and pre-cooling processes also can help eliminate any particulate contamination that may be present on the substrate transfer mechanism or related components.
A positive gas flow from the input chamber to an adjacent process chamber can be provided, for example, during transfer of the substrate to the process cha
Blonigan Wendell T.
Richter Michael W.
White John M.
Applied Komatsu Technology Inc.
Fish & Richardson
Wilson Pamela A.
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