Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-04-03
1992-11-03
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174 522, 174 524, H01R 4300
Patent
active
051597500
ABSTRACT:
A package for containing an integrated circuit component is provided which includes one or more layers with exposed edges surrounding a central opening. The integrated circuit component is positioned in the central opening. Bond wires connect the bond pads of the integrated circuit component to the continuous shelves of the various stepped-back stadium-like layers as well as to individual insulated leads. The layers are spaced apart by beads or columns of insulative material and the major portion of the layers are separated from each other by a gaseous dielectric, preferably air. The R-C constant is reduced and the speed of transmission is increased by the presence of the low dielectric material providing a device which can function rapidly. The stepped portions of the layers are exposed to allow for electrical interconnections within the layers, as well as from each layer to the integrated circuit.
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Demmin Jeffrey C.
DiOrio Mark L.
Dutta Vivek B.
Ewanich Jon T.
Arbes Carl J.
National Semiconductor Corporation
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