Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Reexamination Certificate
2008-01-15
2008-01-15
Kornakov, M. (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
C134S002000, C134S003000, C134S007000, C134S030000, C134S031000, C134S042000, C438S691000, C438S692000, C438S693000
Reexamination Certificate
active
07318870
ABSTRACT:
A cleaning method for a semiconductor substrate including placing the semiconductor substrate into a cleaning chamber and injecting ozone gas (O3) into the cleaning chamber. This process operates to cleanse the semiconductor substrate without corrosion or etching of the semiconductor substrate; even when the substrate has metal layer made of tungsten.
REFERENCES:
patent: 5571367 (1996-11-01), Nakajima et al.
patent: 5896875 (1999-04-01), Yoneda
patent: 6022813 (2000-02-01), Kobayashi et al.
patent: 6207580 (2001-03-01), Costaganna
patent: 6679950 (2004-01-01), Tomita et al.
patent: 2002/0019135 (2002-02-01), Chang
patent: 2002/0134409 (2002-09-01), Scovell
patent: 2002/0155681 (2002-10-01), Hu et al.
patent: 2003/0064604 (2003-04-01), Umeda
patent: 2003/0145875 (2003-08-01), Han et al.
patent: 2004/0020513 (2004-02-01), Bergman
patent: 2000311880 (2000-11-01), None
patent: 2000331978 (2000-11-01), None
patent: 1998-0005766 (1998-03-01), None
patent: 1999-000064 (1999-01-01), None
patent: WO 01/07177 (2001-02-01), None
Handbook of Semiconductor Wafer Cleaning Technology (W. Kern, 1993, p. 13, 24).
Han Dong-Gyun
Kim Young-Jun
Ko Hyung-ho
Park Ki-Jong
Harness & Dickey & Pierce P.L.C.
Kornakov M.
Samsung Electronics Co,. Ltd.
LandOfFree
Method of cleaning semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of cleaning semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of cleaning semiconductor substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2746756