Method of cleaning a silicon wafer using a standard cleaning sol

Details Method of cleaning a silicon wafer using a standard cleaning sol Method of cleaning a silicon wafer using a standard cleaning sol

1998-07-15

2000-11-28

El-Arini, Zeinab

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 3, 134 254, 134 26, 134 28, 134 29, 134 41, 134902, B08B 304, B08B 308, B08B 310, C23G 102

Patent

active

06153014&

ABSTRACT:
A wafer cleaning process using standard cleaning 1 (SC1) solution includes a step of supplementing the cleaning solution with predetermined amounts of NH.sub.4 OH and H.sub.2 O.sub.2, or NH.sub.4 OH, H.sub.2 O.sub.2 and H.sub.2 O during the cleaning of wafers with the solution so that a constant composition of the solution is maintained. After the cleaning solution is replaced with a fresh one, the solution is stabilized for a certain period of time to accomplish a complete mixing of the components therein. The present invention prolongs the useful life of standard cleaning solution and thus contributes to the efficiency of the cleaning process.

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Isao Takahashi et al., "Time-Dependent Variation of Composition of SC1 Solution" Jpn. J. Appl. Phys. vol. 32 (1993) pp. L1183-L1185, Part2, No. 9A, Sep. 1, 1993.

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