Method of clamping a wafer during a process that creates...

Details Method of clamping a wafer during a process that creates... Method of clamping a wafer during a process that creates...

2005-04-05

2005-04-05

Sircus, Brian (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

C361S233000

Reexamination Certificate

active

06876534

ABSTRACT:
This invention relates to electrostatic clamping and associated clamps. A particular method is described of clamping a wafer, during the process that creates asymmetric stress in the wafer, to an electrostatic chuck having a concave portion in its clamping surface characterized in that the wafer is initially clamped around its periphery in a generally flat orientation and then is bowed into the concavity as the asymmetric stress is created in the wafer. It is particularly preferred that the degree of concavity of the chuck is such as to maintain a gas seal between the wafer and the chuck sufficient to allow backside cooling of the water.

REFERENCES:
patent: 4692836 (1987-09-01), Suzuki
patent: 5267607 (1993-12-01), Wada
patent: 5325261 (1994-06-01), Horwitz
patent: 5421401 (1995-06-01), Sherstinsky et al.
patent: 5738729 (1998-04-01), Dubs
patent: 5804089 (1998-09-01), Suzuki et al.
patent: 6162336 (2000-12-01), Lee
patent: 6228208 (2001-05-01), Lill et al.
patent: 197 37 825 (1998-03-01), None
patent: 11-145265 (1999-05-01), None
patent: 11145265 (1999-05-01), None

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