Method of casting photoresist onto substrates

Details Method of casting photoresist onto substrates Method of casting photoresist onto substrates

2005-04-05

2005-04-05

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S325000, C430S326000, C427S133000, C427S300000, C427S358000, C427S369000, C427S370000, C427S384000, C264S331150, C264S331180, C264S337000, C264S338000

Reexamination Certificate

active

06875553

ABSTRACT:
A method for casting a thick layer of photoresist material onto a substrate. The method including the steps of pressing the photoresist against the substrate material using a presser plate and limiting the travel of the presser plate by using spaces which can be positioned on the substrate material. The process further including the step of holding the presser plate in a pressed position while the photoresist is at least partially cured or solidified.

REFERENCES:
patent: 5985067 (1999-11-01), Schmid et al.
patent: 6191053 (2001-02-01), Chun et al.
patent: 6509085 (2003-01-01), Kennedy
“Polydimethysiloxane, a photocurable rubberelastic polymer used as spring material in micromechanical sensors” by J.C. Lotters, W. Olthuis, P.H. Veltink, P. Bergveld,Microsystem Technologies(1997) 64-67, Springer-Verlag 1997.
“MEMS Materials and Fabrication Technology on Large Areas: The Example of an X-ray Imager” by J.H. Daniel, and others,Mat. Res. Soc. Symp., vol. 657 ©2001 Materials Research Society.
“SU-8 photoepoxy: A new material for FPD or PDP applications” by L.J. Guerin, C.W. Newquist. Ph. Renaud.Display Works, 98, San Jose, Jan. 20-22, 1998.

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