Method of bonding multilayer structures of crystalline materials

Details Method of bonding multilayer structures of crystalline materials Method of bonding multilayer structures of crystalline materials

1992-11-09

1995-09-12

King, Roy V.

Superconductor technology: apparatus, material, process

Processes of producing or treating high temperature...

Semiconductor device or thin film electric solid-state...

505329, 505701, 505702, 427 62, 148DIG12, 437 86, 437974, 156182, 1563082, H01L 3900

Patent

active

054496594

ABSTRACT:
A method for producing multilayer structures comprised of materials with incompatible processing parameters is disclosed. A bonding layer of arbitrary dielectric constant is applied to each of two substructures. Each substructure is composed of a substrate and at least one epitaxial crystalline layer. Examples of particular bonding materials used are polyimide, fluorocarbon polymers, other organic materials, and glass. The bonding material may be applied like photoresist, or sputtered, or applied in any appropriate manner consistent with the processing constraints of the crystalline materials. Structures formable in this way include superconductor-amorphous dielectric-superconductor and ferroelectric-insulator-semiconductor trilayers, as well as microwave resonators and multichip modules.

REFERENCES:
patent: 4624727 (1986-11-01), Scola et al.
patent: 4908328 (1990-03-01), Hu et al.
patent: 4942142 (1990-07-01), Itozaki et al.
patent: 5130294 (1992-07-01), Char
patent: 5168078 (1992-12-01), Reisman et al.
"Biaxialy Aligned YBa.sub.2 Cu.sub.3 O.sub.7-.delta. thin film tapes", Y. Iijima, et al., Physica C, 185-189, 1991, pp. 1959-1960.

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