Method of bonding electronic components

Details Method of bonding electronic components Method of bonding electronic components

1981-01-27

1983-08-02

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228180A, 228253, 228254, B23K 120, H01L 2160

Patent

active

043961401

ABSTRACT:
Disclosed is a method of bonding electronic components (14) to metallized substrates (21) by soldering. The solder is first deposited on an unmetallized substrate (10) in a pattern of discrete pads (11, 12, 13) corresponding to the leads (28, 29, 30) of the components to be bonded. The component leads are then placed on the pads and the solder is reflowed. The solder thereby adheres to the leads so that a controlled amount of solder will remain on each lead when the component is lifted from the substrate. The components can then be soldered to an appropriate metallized substrate.

REFERENCES:
patent: 3516155 (1970-06-01), Smith
patent: 4332341 (1982-06-01), Minetti
IBM Technical Disclosure Bulletin, article entitle, "Tinning Preplated Sites on a Substrate", vol. 19, No. 8, p. 3049, (1977).

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