4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Donald Jaffe

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Encapsulation of integrated circuits

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method of bonding electronic components

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Donald Jaffe does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Donald Jaffe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Donald Jaffe will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-709442

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure