Method of bonding a titanium containing sputter target to a back

Details Method of bonding a titanium containing sputter target to a back Method of bonding a titanium containing sputter target to a back

1992-06-10

1994-02-01

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429812, 228208, C23C 1434

Patent

active

052829430

ABSTRACT:
Methods of bonding a titanium containing sputter target member to a heat conductive backing member, such as a copper backing plate, and bonded target/backing plate assemblies are disclosed. Due to the poor wettability of titanium based materials, a uniform, thin film of aluminum is coated thereover and acts as an anchor layer for application of tin and/or indium based solder layers thereover to securely solder bond the target and backing plate. The aluminum coating is sputter coated onto the target. Then, the coated target is heated in an oxygen containing atmosphere. The thus treated titanium target is then ready for conventional solder joining to a copper backing plate or the like by use of tin, lead, and/or indium based solder metals.

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"Magnetron Sputtered Titanium-Tungsten Films," Michael Hill, Solid State Technology, Jan. 1980, pp. 53-59.

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