Method of bonding a sputter target-backing plate assembly assemb

Details Method of bonding a sputter target-backing plate assembly assemb Method of bonding a sputter target-backing plate assembly assemb

1992-03-18

1993-07-27

Heinrich, Samuel M.

Metal fusion bonding

Process

With shaping

22826311, 228174, 228265, 20429812, 20429813, C23C 1434, B23K 3100

Patent

active

052304590

ABSTRACT:
Methods of preparing a sputter target/backing plate assembly and assemblies so prepared are disclosed. The methods comprise forming a plurality of grooves in one of the metal surfaces to be joined in the bonding process. The grooves are each provided in a closed, loop configuration or pattern. The target and backing plate to be bonded are adjacently positioned to form an assembly with the grooved surface forming one of the interfacial joint surfaces. The assembly is then placed in a controlled atmosphere, such as a vacuum, heated to a temperature just below the melting point of the lower melting metal to be joined, and pressed until the grooves are substantially filled with metal or alloy from the other, non-grooved interfacial surface.

REFERENCES:
patent: 4468313 (1984-08-01), Okumura et al.
patent: 4610774 (1986-09-01), Sakata et al.
patent: 4752335 (1988-06-01), Korb
patent: 4820397 (1989-04-01), Fielder et al.
patent: 4826584 (1989-05-01), Ribeiro
patent: 5009765 (1991-04-01), Qamar et al.
patent: 5066381 (1991-11-01), Ohta et al.

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