Method of attaching a leadframe to singulated semiconductor dice

Details Method of attaching a leadframe to singulated semiconductor dice Method of attaching a leadframe to singulated semiconductor dice

1997-04-29

2000-01-25

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438 11, 438 14, 438 15, 438 18, 438111, 438113, 438123, 438460, H01L 2144, H01L 2148, H01L 2150

Patent

active

060177764

ABSTRACT:
The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.

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patent: 5208188 (1993-05-01), Newman
patent: 5221642 (1993-06-01), Burns
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5579573 (1996-12-01), Baker et al.
patent: 5681757 (1997-10-01), Hayes
patent: 5683944 (1997-11-01), Joiner et al.
patent: 5776799 (1998-07-01), Song et al.

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