Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-05-02
2006-05-02
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S678000, C257S414000, C257S415000, C257S728000, C257S782000, C257S786000, C438S124000, C438S126000, C438S127000, C310S31300R, C310S340000, C361S772000
Reexamination Certificate
active
07038321
ABSTRACT:
A method of flip-chip mounting a circuit device to a substrate in a manner that avoids damage and impairment of a fragile or otherwise sensitive element on the device facing the substrate, and a circuit assembly produced thereby. The assembly includes a substrate having at least two sets of bonding sites spaced apart from each other to define an intermediate surface region therebetween. The device is attached to the bonding sites with solder connections, with the solder connections being present on a surface of the device that faces the substrate and on which the element is present so that the element overlies the intermediate surface region of the substrate. An underfill material is present between the device and the substrate and encapsulates the solder connections. The underfill material is separated from the intermediate surface region of the substrate so that the underfill material does not contact the element.
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Chavan Abhijeet V.
Ihms David W.
Isenberg John K.
Jay Ian D.
Mars Jeffrey A.
Chmielewski Stefan V.
Chu Chris C.
Delphi Technologies Inc.
Parker Kenneth
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