Method of attaching a die to a substrate

Details Method of attaching a die to a substrate Method of attaching a die to a substrate

2005-04-05

2005-04-05

Clark, Jasmine (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S123000, C438S119000, C438S127000

Reexamination Certificate

active

06875635

ABSTRACT:
A semiconductor device30includes a base carrier32, an adhesive material layer36and an integrated circuit die34. The base carrier32has a top side and a bottom side, the top side having a central area for receiving the die34and a peripheral area surrounding the central area. The adhesive material layer36is disposed on the top side of the base carrier in an “X” shaped pattern. The “X” shaped pattern includes two bisecting lines. The two bisecting lines extend well beyond the central area and into the peripheral area of the base carrier top surface. The die34is attached to the base carrier32with the adhesive material layer36at the central area. Even after attachment of the die34, the adhesive material36extends well beyond the die34and the central area into the peripheral area.

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