Method of attaching a die onto a pad of a lead frame

Details Method of attaching a die onto a pad of a lead frame Method of attaching a die onto a pad of a lead frame

1996-04-15

1998-12-22

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438118, H01L 2144

Patent

active

058518533

ABSTRACT:
An improved method of attaching a semiconductor chip onto a die pad of a lead frame using an epoxy adhesive by dispensing the epoxy adhesive onto the die pad, decreasing a viscosity of the epoxy adhesive dispensed onto the die pad by blowing a hot gas over at least part of the epoxy adhesive thereby preventing a formation of an epoxy tail, and placing the chip into the adhesive to attach the chip to the die pad. The hot gas used may be air or nitrogen, having a temperature from 50.degree. C. to 70.degree. C. The hot gas is blown from a blower between the die pad and the dispenser, and may be blown onto the epoxy adhesive from more than one direction.

REFERENCES:
patent: 4642158 (1987-02-01), Steinel et al.
patent: 4778642 (1988-10-01), Lee et al.
patent: 5423889 (1995-06-01), Colquitt et al.
"Microelectronics Packaging Handbook",edited by Rao R. Tummala and Eugene J. Rymaszewski, Van Nostrand Reinhold, No Date.
"Electronic Materials Handbook" vol. 1, Packaging, Prepared under the direction of the ASM International Handbook Committee, No Date.

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