Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1996-04-15
1998-12-22
Picardat, Kevin
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438118, H01L 2144
Patent
active
058518533
ABSTRACT:
An improved method of attaching a semiconductor chip onto a die pad of a lead frame using an epoxy adhesive by dispensing the epoxy adhesive onto the die pad, decreasing a viscosity of the epoxy adhesive dispensed onto the die pad by blowing a hot gas over at least part of the epoxy adhesive thereby preventing a formation of an epoxy tail, and placing the chip into the adhesive to attach the chip to the die pad. The hot gas used may be air or nitrogen, having a temperature from 50.degree. C. to 70.degree. C. The hot gas is blown from a blower between the die pad and the dispenser, and may be blown onto the epoxy adhesive from more than one direction.
REFERENCES:
patent: 4642158 (1987-02-01), Steinel et al.
patent: 4778642 (1988-10-01), Lee et al.
patent: 5423889 (1995-06-01), Colquitt et al.
"Microelectronics Packaging Handbook",edited by Rao R. Tummala and Eugene J. Rymaszewski, Van Nostrand Reinhold, No Date.
"Electronic Materials Handbook" vol. 1, Packaging, Prepared under the direction of the ASM International Handbook Committee, No Date.
Jun Jong Keun
Kim Tae Hyuk
Lee Hwa Young
Lee Jae Won
Picardat Kevin
Samsung Electronics Co,. Ltd.
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