Method of attaching a component to a plate-shaped support

Metal fusion bonding – Process – Plural joints

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2281801, B23K 3100, B23K 3102

Patent

active

060561882

ABSTRACT:
A method of attaching an electronic component to a surface of a plate-shaped support member has as a first step the step of applying the electronic component to the surface of the support member, a solder being arranged between the electronic component and the support member. Following this, a glass fiber or a glass fiber bundle is applied to the surface of the plate-shaped support member located opposite the electronic component. Finally, a laser pulse is conducted through the glass fiber or glass fiber bundle for melting the solder so as to establish a punctiform electrical and mechanical connection between the support member and the electronic component in this way.

REFERENCES:
patent: 4799755 (1989-01-01), Jones
patent: 5055652 (1991-10-01), Jones et al.
patent: 5438579 (1995-08-01), Eda et al.
patent: 5481082 (1996-01-01), Yamamoto
Somasiri, N. et al, "A Process for Surface Texturing of Kapton Polyimide to Improve Adhesion to Metals", 798-801; Dec. 1991, IEEE, vol. 14, No. 4.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of attaching a component to a plate-shaped support does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of attaching a component to a plate-shaped support, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of attaching a component to a plate-shaped support will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1587270

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.