Method of applying encapsulant to wire bonds

Details Method of applying encapsulant to wire bonds Method of applying encapsulant to wire bonds

2007-09-25

2009-11-17

Garber, Charles D. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S127000, C257S784000

Reexamination Certificate

active

07618842

ABSTRACT:
A method of applying encapsulant to wire bonds between a die and conductors on a supporting substrate, by forming a bead of the encapsulant on a profiling surface, positioning the profiling surface such that the bead contacts the die and, moving the profiling surface relative to the die to cover the wire bonds with the encapsulant. Wiping the encapsulant over the wire bonds with a profiling surface provides control of the encapsulant front as well as the height of the encapsulant relative to the die. The movement of the profiling surface relative to the die can closely controlled to shape the encapsulant to a desired form. Using the example of a printhead die, the encapsulant can be shaped to present an inclined face rising from the nozzle surface to a high point over the wire bonds. This can be used by the printhead maintenance facilities to maintain contact pressure on the wiping mechanism. However, it will be appreciated that the encapsulant can be shaped to have ridges, gutters, grooves and so on by using a particular shape of profiling surface and relative movement with the die.

REFERENCES:
patent: 5008736 (1991-04-01), Davies et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5577319 (1996-11-01), Knecht
patent: 6022583 (2000-02-01), Falcone et al.
patent: 6143588 (2000-11-01), Glenn
patent: 6291884 (2001-09-01), Glenn et al.
patent: 6326240 (2001-12-01), Liaw
patent: 6359335 (2002-03-01), Distefano et al.
patent: 6414849 (2002-07-01), Chiu
patent: 6644782 (2003-11-01), Ward et al.
patent: 6709893 (2004-03-01), Moden et al.
patent: 6790473 (2004-09-01), Papathomas et al.
patent: 6885093 (2005-04-01), Lo et al.
patent: 7074651 (2006-07-01), Lien
patent: 7275308 (2007-10-01), Kim et al.
patent: 2001/0014486 (2001-08-01), Glenn
patent: 2003/0160311 (2003-08-01), Ismail et al.
patent: 2007/0045872 (2007-03-01), Fee
patent: 2008/0158298 (2008-07-01), Serbicki et al.
patent: 2009/0032926 (2009-02-01), Sharifi
patent: WO 03/006230 (2003-01-01), None

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