Method of and platen for controlling removal rate...

Details Method of and platen for controlling removal rate... Method of and platen for controlling removal rate...

2005-10-18

2005-10-18

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S307000, C451S296000

Reexamination Certificate

active

06955588

ABSTRACT:
Methods and a platen control parameters of a removal rate characteristic in chemical mechanical planarization, while allowing a low-cost polishing pad to be used especially in fast edge operations, and while reducing the amount of fluid used to support the polishing pad. Platen configuration provides fluid pressure control to reduce leakage of fluid from beneath the polishing pad, and contributes to control of a location of an inflection point of the removal rate characteristic. Another configuration controls a shape of a section of the removal rate characteristic between the inflection point and a leading wafer edge.

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