Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1994-03-21
1995-04-18
Larkins, William D.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257666, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
054081270
ABSTRACT:
An integrated circuit package is disclosed herein including one or more dies, each of which has an array of input/output bond pads, a leadframe which includes an array of electrically conductive leads, and an array of bonding wires, each of which extends along its length between and is connected at its opposite ends to a respective die bond pad and a corresponding lead on the leadframe or a corresponding die bond pad on another die. There is also disclosed a technique for using a bridge arrangement to prevent the bonding wires from contacting the die or dies along the length of each of the wires. In fabricating the package just described, the bridge arrangement is provided as part of either the leadframe or part of a heater block which is a component of the equipment that may be used in manufacturing the integrated circuit package.
Clark S. V.
Larkins William D.
National Semiconductor Corporation
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