Method of and arrangement for etching an etch material consistin

Details Method of and arrangement for etching an etch material consistin Method of and arrangement for etching an etch material consistin

1990-10-03

1991-12-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156640, 156656, 1566591, 156902, B44C 122, C23F 0000

Patent

active

050715089

ABSTRACT:
The invention concerns a method of etching an etch material consisting at least partly of metal and an arrangement for implementing that method.
According to the invention, the etchant is applied through jet assemblies arranged perpendicularly to each other on the top and the bottom side of the etch material. During the passage of the etch material, the spray pressure at the jet assemblies or the jets may be set to constant values and/or be individually controlled as a function of the quantity of metal to be etched off the top and the bottom side. The invention is particularly suitable for etching circuit boards, whose conductors on the top and the bottom side are arranged perpendicularly to each other.

REFERENCES:
patent: 3401068 (1968-09-01), Benton
patent: 3788912 (1974-01-01), Frantzen et al.
patent: 3808067 (1974-04-01), Brown
patent: 4352994 (1982-10-01), Inzoli et al.
patent: 4397708 (1983-08-01), Frantzen
patent: 4741798 (1988-05-01), Haas
patent: 4772365 (1988-09-01), Haas
Adjustable Nozzles for Spray Etchers, Holemann et al., IBM Technical Disclosure Bulletin, vol. 13, No. 12, May 1971.

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