Metal fusion bonding – Process – Plural joints
Patent
1993-03-19
1994-07-12
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
H01R 4302, H01L 2160
Patent
active
053280792
ABSTRACT:
Certain components of an integrated circuit package are disclosed herein including one or more dies, each of which has an array of die output/input bond pads, and die support means, for example a substrate or leadframe, which includes an array of electrically conductive leads. There is also disclosed herein a technique for wire bond connecting the bond pads of a particular die to either the bond pads of a second die or to the electrically conductive leads of the substrate or leadframe using a thermosonic or thermocompression ball bonding tool. In accordance with this technique, where at least one die is involved, connections are made to the bond pads of that die by means of stitch bonding in a way which does not damage the die.
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A Novel Multichip Module Assembly Approach Using Gold Ball Flip-Chip Bonding; Goodman, Cathryn E. and Metroka, Michael P.; IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, No. 4, Aug. 1992.
Mathew Ranjan J.
Nguyen Luu T.
Smith Arnold
National Semiconductor Corporation
Ramsey Kenneth J.
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