Method of and apparatus for laminating a semiconductor wafer wit

Details Method of and apparatus for laminating a semiconductor wafer wit Method of and apparatus for laminating a semiconductor wafer wit

1998-07-13

2000-03-21

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562733, 1562755, 1563796, 156510, 156523, 83 73, 836511, B32B 3128, B32B 3118

Patent

active

060398302

ABSTRACT:
A semiconductor wafer tape laminating system includes a loading device for conveying a wafer or cassette to a predetermined location where a laminating process is performed. A laminating device attaches UV tape to the front surface of the wafer conveyed by the loading device. A precutting device having a knife cuts the UV tape around the wafer as spaced therefrom to leave an edge of the tape protruding beyond the peripheral edge of the wafer. A wire cutting device having a wire removes the edge of the UV tape left around the wafer by the precutting device. An ultra-violet illuminator irradiates the edge of the UV tape with ultra-violet rays, and an unloading device carries the wafer to a downstream processing station. When the edge of the UV tape is irradiated with ultra-violet rays, it loses its adhesive strength. Accordingly, the edge will not attach itself to the wafer or to a piece of processing equipment after it is removed by the wire cutting device.

REFERENCES:
patent: 4779497 (1988-10-01), Lee
patent: 5840614 (1998-11-01), Sim et al.

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